HDI Conference and Exposition



	MONDAY SEPTEMBER 14, 1998 TUTORIALS 9:00am to 5:00pm T1 Flip Chip Packaging & Assembly Dr. Karl Puttlitz, IBM Corp. This tutorial introduces flip chip processes, materials and assembly. The various underbump metalurgy, bumping processes and underfills are reviewed with examples highlighted. T2 HDI Design: Rising To the Challenge. Mike Fitts, The Solution Fitts This tutorial introduces the important design elements for creating advanced, high-density PCBs. The features discussed will include blind and buried vias, sequential lamination and specifically, high-density interconnect structures (HDIS), sometimes called microvias. Requirements and important features of CAD systems, selection of design rules and structures, predictive writing models, and software processes are covered in detail. T3 Advanced PWBs (HDI) for Packaging & Boards Happy Holden, Techlead Corp Advanced printed wiring boards utilize blind and buried vias and the new microvias or HDI. This tutorial covers the most popular HDI manufacturing process of laser , plasma and photo-dielectrics. Design rules, materials and examples are also highlighted. T4 Advanced Organic Substrate Materials Bob Holmes, formerly Lucent The new popularity of organic packages and high performance printed wiring require new materials of construction. This lecture covers these new engineered materials, their properties and applications. TUESDAY SEPTEMBER 15, 1998 SEMINARS 8:00 to 10:00am S1 HDI Design: Process, Tools, Models and Systems. Mike Fitts, Solution Fitts The fundamentals of CAD systems, design processes and autorouters for HDI board design is documented. S2 HDI Application Case Studies Dr. Walter Schmidt, Dyconex Twenty high performance products and the HDI PWBs they employ are examined in detail. S3 BGA and CSP Technologies: Design, Packaging, Assembly and Reliability Tom Chung, Aptos. This seminar will review and discuss key practices and trends of both ball-grid array (BGA) and chip-scale packaging (CSP) technologies. The seminar will include a discussion of the characteristics of different types of BGA and CSP, package and board design guidelines and considerations, assembly and packaging issues/solutions, board assembly/rework, reliability tests and data analyses, package availability, cost and new developments in package technology. S4 Laser Via Generation Anton Kitai, Lumonics The latest techniques for laser via fabrication in PWB and laser cutting of solder paste stencils is examined in detail. SPECIAL SESSION HDI Opportunities in Wireless Communications 10:30-11:00am Stan Bruederle, Dataquest The opportunities for HDI created by the compact size, high complexity, and high frequencies of wireless communications devices will be discussed. -sponsored by Meptec 10:30am - 3:00pm EXHIBITS OPEN KEYNOTE PLENARY SESSION The Challenges of HDI 11:00am-12:00noon Dr. Bill Siu , Vice President , Intel Corp. HDI products will continue to attract attention; the challenges of managing these new products is examined. WORKSHOPS3:00 to 4:30pm W1 Flip Chip Topics John Persic, Celestica Inc. Design, fabrication, assembly and test issues of flip chip are discussed. W2 Advanced Organic Materials Will Glover & Bob Forcier , Nelco New high temperature, low loss, HDI-compatible laminate materials are discussed. W3 Advanced Assembly of BGAs & CSPs Lee Smith, Amkor/Anam The next three years of advanced packaging and assembly processes are discussed. W4 Reliability of Area Array Packages Bob Munroe, Motorola The extensive work done by Motorola on BGAs and CSPs are reviewed. 4:30 to 6:00pm OPENING NIGHT RECEPTION WEDNESDAY SEPTEMBER 16, 1998 TECHNICAL SESSIONS 8:00 to 10:00am TS1 ADVANCED PROCESSES: Advanced Manufacturing Chair Bob Holmes Manufacturing Methods for HDI Structures - Pradeep Ghandi, Ormet Conductive Pastes - Donold Schroder, CTS Corp. Photo Imagable Dielectrics - Ivan Ho, Ciba-Geigy Corp. MicroVia PWBs - John Whitley, Hadco TS2 APPLICATIONS AND THE MARKET: HDI in OEM Products *Chair: Happy Holden* CSP Influence on Evolutionary Design - Dale Lee, Iomega The Multi-Chip Package: A Cost-Effective Alternative - Jae-Min Liao, Intel Corp. The New Mobile Pentium II - Intel Corp. An OEM's View of High Performance HDI Substrates - Richard Carboneau, Storage Technology TS3 EMERGING TECHNOLOGIES & MATERIALS: Important Trends in the HDI Industry *Chair: Mike Fitts* Flip Chip Assembly Using Conductive Adhesives - Dick Estes, Polymer Flip Chip Need for High Freequency Materials in High Speed - Art Heuayo, Rogers Corp. The ULTRA CSP - Hong Yang & Peter Elenius, Flip Chip Technologies Wafer Level Packaging of Compliant CSP's using Flexible Film Interposers - Joe Fjelstad, Tessera KEYNOTE PLENARY SESSION 2 Opportunities in High Density Interconnects...The Best System Solutions 11:00am-12:00noon Dr. Harry Hollack, President, Flip Chip Technologies This keynote address will compare flip-chip vs. chip-scale packaging options for high-density interconnects (HDI). Dr. Hollack will look at assembly cost, including PCB technology costs. In addition, redistribution technology, standard flip-chip and wafer-level chip scale packages (CSP) will be explored. 10:30am - 3:00pm EXHIBITS OPEN WORKSHOPS 3:00 to 4:30pm W5 Selecting HDI Design Rules and Structures Happy Holden, Techlead Corp This workshop focuses on the prediction of wiring demands from HDI circuits and the various design rules and structures to allow these designs. W6 Novel HDI Substrates that use Filled Via Technologies Dr. Gordon Matijasevic, ORMET A novel new process that is increasing in popularity is the use of high-density flexible layers and conductive inks to build and interconnect multilayer substrates. This workshop covers the characteristics of organic-metallic composite pastes, design rules, the new manufacturing processes and reliability testing results. Dr. Matijasevic will also give examples of how this technology has been applied. W7 Flip Chip Design Through Assembly Jim Leal and Peter Elenius, Flip Chip Technologies The demands for a higher number of I/Os, better electrical performance, and lower packaging costs are driving the need for flip-chip technologies. This workshop highlights the solutions available through the use of flip-chip technology. W8 New Applications of Lasers For HDI Processes Alan Cable, ESI Laser technologies are improving so rapidly that it is difficult to keep up with innnovations. The current applications for UV laser are discussed with respect to HDI via generation and emerging lithography and metalization.